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 PD - 93940
IRF7701
HEXFET(R) Power MOSFET
l l l l l
Ultra Low On-Resistance P-Channel MOSFET Very Small SOIC Package Low Profile (< 1.1mm) Available in Tape & Reel
VDSS
-12V
RDS(on) max
0.011@VGS = -4.5V 0.015@VGS = -2.5V 0.022@VGS = -1.8V
ID
-10A -8.5A -7.0A
Description
HEXFET(R) power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design , that International Rectifier is well known for, provides thedesigner
1 2 3 4 1= 2= 3= 4= D S S G
D
8 7
G
6
S
8= 7= 6= 5= D S S D
5
with an extremely efficient and reliable device for use in battery and load management.
The TSSOP-8 package, has 45% less footprint area of the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium. The low profile (<1.1mm) of the TSSOP-8 will allow it to fit easily into extremely thin application environments such as portable electronics and PCMCIA cards.
TSSOP-8
Absolute Maximum Ratings
Parameter
VDS ID @ TA = 25C ID @ TA = 70C IDM PD @TA = 25C PD @TA = 70C VGS TJ, TSTG Drain- Source Voltage Continuous Drain Current, VGS @ -4.5V Continuous Drain Current, VGS @ -4.5V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Junction and Storage Temperature Range
Max.
-12 10 8.0 80 1.5 0.96 12 8.0 -55 to + 150
Units
V A
W mW/C V C
Thermal Resistance
Parameter
RJA Maximum Junction-to-Ambient
Max.
83
Units
C/W
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1
6/21/00
IRF7701
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)DSS
V(BR)DSS/TJ
Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
Min. -12 --- --- --- --- -0.45 21 --- --- --- --- --- --- --- --- --- --- --- --- --- ---
Typ. Max. Units Conditions --- --- V V GS = 0V, ID = -250A -0.006 --- V/C Reference to 25C, ID = -1mA --- 0.011 VGS = -4.5V, ID = -10A --- 0.015 VGS = -2.5V, ID = -8.5A --- 0.022 VGS = -1.8V, ID = -7.0A --- -1.2 V VDS = VGS, ID = -250A --- --- S VDS = -10V, I D = -10A --- 1.0 VDS = -12V, VGS = 0V A --- -25 VDS = -9.6V, VGS = 0V, TJ = 70C --- -100 VGS = -8.0V nA --- 100 VGS = 8.0V 69 100 ID = -8.0A 9.1 14 nC VDS = -9.6V 21 32 VGS = -4.5V 19 --- VDD = -6.0V ns 20 --- ID = -1.0A 240 --- RD = 6.0 220 --- VGS = -4.5V 5050 --- VGS = 0V 1520 --- pF VDS = -10V 1120 --- = 1.0MHz
Source-Drain Ratings and Characteristics
IS
ISM
VSD trr Qrr
Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge
Min. Typ. Max. Units --- --- --- --- --- --- --- --- 52 53 -1.5 A -80 -1.2 78 80 V ns nC
Conditions MOSFET symbol showing the G integral reverse p-n junction diode. TJ = 25C, IS = -1.5A, VGS = 0V TJ = 25C, IF = -1.5A di/dt = 100A/s
D
S
Notes:
Repetitive rating; pulse width limited by
max. junction temperature.
When mounted on 1 inch square copper board, t<10 sec
Pulse width 300s; duty cycle 2%.
2
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IRF7701
100
VGS -7.00V -4.5V -3.0V -2.5V -1.8V -1.5V -1.2V BOTTOM -1.0V TOP
100
-I D , Drain-to-Source Current (A)
10
-I D , Drain-to-Source Current (A)
VGS -7.00V -4.5V -3.0V -2.5V -1.8V -1.5V -1.2V BOTTOM -1.0V TOP
10
1
-1.0V
1
0.1
-1.0V
0.01 0.1
20s PULSE WIDTH TJ = 25 C
1 10
0.1 0.1
20s PULSE WIDTH TJ = 150 C
1 10
-VDS , Drain-to-Source Voltage (V)
-VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
2.0
-I D , Drain-to-Source Current (A)
TJ = 150 C
R DS(on) , Drain-to-Source On Resistance (Normalized)
TJ = 25 C
ID = -10A
1.5
10
1.0
1
0.5
0.1 1.0
V DS = -10V 20s PULSE WIDTH 1.5 2.0 2.5 3.0
-VGS , Gate-to-Source Voltage (V)
0.0 -60 -40 -20
VGS = -4.5V
0 20 40 60 80 100 120 140 160
TJ , Junction Temperature ( C)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
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3
IRF7701
8000 VGS = 0V, f = 1 MHZ Ciss = C + C , C gs gd ds SHORTED Crss = C gd Coss = C + C ds gd 10
ID = -10A
VDS = -9.6V
-VGS , Gate-to-Source Voltage (V)
8
6000
C, Capacitance(pF)
Ciss
6
4000
4
Coss
2000
Crss
2
0 1 10 100
0 0 20 40
FOR TEST CIRCUIT SEE FIGURE 13
60 80 100
-V DS, Drain-to-Source Voltage (V)
QG , Total Gate Charge (nC)
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
100
1000
-ISD , Reverse Drain Current (A)
OPERATION IN THIS AREA LIMITED BY R DS(on)
TJ = 150 C
10
-ID , Drain Current (A) I
100 100us
TJ = 25 C
1
1ms 10 10ms
0.1 0.2
V GS = 0 V
0.4 0.6 0.8 1.0 1.2 1.4
1 0.1
TA = 25 C TJ = 150 C Single Pulse
1 10 100
-VSD ,Source-to-Drain Voltage (V)
-VDS , Drain-to-Source Voltage (V)
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
4
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IRF7701
10.0
VDS
8.0
RD
VGS RG
D.U.T.
+
-ID , Drain Current (A)
6.0
VGS
4.0
Pulse Width 1 s Duty Factor 0.1 %
2.0
Fig 10a. Switching Time Test Circuit
td(on) tr t d(off) tf
0.0 25 50 75 100 125 150
VGS 10%
TC , Case Temperature ( C)
Fig 9. Maximum Drain Current Vs. Case Temperature
90% VDS
Fig 10b. Switching Time Waveforms
100 D = 0.50
Thermal Response (Z thJA )
0.20 10 0.10 0.05 0.02 1 0.01 PDM SINGLE PULSE (THERMAL RESPONSE) t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJA + TA 0.0001 0.001 0.01 0.1 1 10 100
0.1
0.01 0.00001
t1 , Rectangular Pulse Duration (sec)
Fig 10. Typical Effective Transient Thermal Impedance, Junction-to-Ambient
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-
VDD
5
IRF7701
R DS(on) , Drain-to -Source On Resistance ( )
R DS (on) , Drain-to-Source On Resistance ( )
0.05
0.020
0.04
0.015 VGS = -2.5V
0.03
0.02
ID = -10A
0.010 VGS = -4.5V
0.01
0.00 1.5 2.5 3.5 4.5
0.005 0 20 40 60 80 100 -I D , Drain Current (A)
-V GS, Gate -to -Source Voltage (V)
Fig 11. Typical On-Resistance Vs. Gate Voltage
Fig 12. Typical On-Resistance Vs. Drain Current
Current Regulator Same Type as D.U.T.
50K
QG QGS VG QGD
12V
.2F .3F
VGS
-3mA
Charge
IG
ID
Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform
Fig 13b. Gate Charge Test Circuit
6
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+
D.U.T.
-
VDS
IRF7701
0.80 40
-V GS(th) , Variace ( V )
0.60
30
0.40
Power (W)
150
ID = -250A
20
0.20
10
0.00 -75 -50 -25 0 25 50 75 100 125
0 0.01 0.10 1.00 10.00 100.00
T J , Temperature ( C )
Time (sec)
Fig 14. Threshold Voltage Vs. Temperature
Fig 15. Typical Power Vs. Time
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7
IRF7701
TSSOP-8 Part Marking Information
EXAMPLE: T HIS IS AN IRF7702
LOT CODE (XX) PART NUMBER
DAT E CODE (YW)
XXYW 7702
T ABLE 1 WORK WEEK 1-26, NUMERIC YEAR CODE (1,2, ....ET C.) YEAR 2001 2002 2003 1994 1995 1996 1997 1998 1999 2000 Y 1 2 3 4 5 6 7 8 9 0 WORK WEEK 01 02 03 04 W A B C D
DAT E CODE EXAMPLES : 9503 = 5C 9532 = EF
24 25 26
X Y Z
T ABLE 2 WORK WEEK 27-52, ALPHANUMERIC YEAR CODE (A,B, ...ETC.) YEAR 2001 2002 2003 1994 1995 1996 1997 1998 1999 2000 Y A B C D E F G H J K WORK WEEK 27 28 29 30 W A B C D
50 51 52
X Y Z
TSSOP-8 Tape and Reel
8LT SSOP (MO-153AA)
16 mm
O 13"
16mm 8 mm FEED DIRECT ION NOT ES: 1. T APE & REEL OUT LINE CONFORMS T O EIA-481 & EIA-541.
8
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IRF7701
TSSOP-8 Package Outline
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000 IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111 IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086 IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630 IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936 Data and specifications subject to change without notice. 6/00
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9


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